Wireless Data Management Bundles

Wireless

Data Management Bundles

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Unlock a smarter way of measuring with a connected approach that brings precision tools and wireless data transfer together. By combining proven Mitutoyo instruments with U-WAVE technology, measurement results can be captured instantly and transmitted directly into your digital systems, eliminating manual entry, reducing errors and improving overall efficiency.

Whether on the shopfloor or in the lab, wireless connectivity ensures a smooth, reliable flow of data, helping you maintain control over quality processes at all times. Explore the bundles below and use the dealer map to find your local certified partner, ready to support you in implementing the right wireless solution for your application.

Choose Your Bundle

Caliper Bundle

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Indicator Bundle

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Micrometer Bundle

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Caliper Bundle

WIDE VMU Video Microscope Units

Small, lightweight microscope units to be integrated into automatic optical
inspection devices (AOI) and repair equipment of all sizes.

Optical Measurement Systems

A VMU provides a simple and compact system that allows microphotography and simultaneous external monitor observations. It can be used in vertical and inverted positions according to your application requirements. Making note of the massive variety of matching Mitutoyo objectives in the visible, UV, NUV, and NIR light spectrum regions are available for almost any application.

Optical Measurement Systems

APPLICATION SAMPLES:

> A compact microscope for laser applications - compatible with YAG lasers:

Peeling off protective films and organic thin-films
Cutting of IC wiring (Au, Al) and exposure of lower layer pattern
FPD defect repair
Photomask repair
Marking, trimming, patterning, spot annealing, and scribing lasers are supported, including femtosecond lasers

>Vertical or horizontal digital microscope systems involving a digital sensor:

For microphotography and observation of metallic, resinous, and printed surfaces
Micro-fluid analysis
Cell and microorganism observation/analysis
Defect detection

> For IR analysis/inspection systems using Mitutoyo M Plan Apo NIR objectives:

For nondestructive inspection systems like on-wafer probing
Thickness measurement of LCD thin-film and silicon board film
Internal inspection/analysis and 3D evaluation of MEMS
Internal observation of IC packages, void inspection/evaluation of wafer stacks
Spectral characteristic analysis using an infrared source

> For dual-camera (high & low magnification) observation:

For observation systems using the same area but with different magnifications simultaneously

The Mitutoyo Products:

> WIDE VMU - Video Microscope Units

All Mitutoyo VMU's

> M Plan APO HR 10X - Objective Lens

All Mitutoyo Objectives

Indicator Bundle

Digital Scales

With an extensive line of high-accuracy and high-speed models available,
Mitutoyo can provide a digital scale solution for practically any application.

Linear Encoders and DRO Systems

Mitutoyo digital scales deliver ultimate precision and accuracy to in-house machine tool and manufacturing applications, while also providing world-class shock resistance, measurement accuracy, and versatility needed for your most stringent applications.

Linear Encoders and DRO Systems

The Mitutoyo Products:

> AT1100 Series - NC Linear Scales

All Mitutoyo NC Linear Scales

APPLICATION SAMPLES:

> IC production and quality control devices e.g. wire bonding, appearance inspection, or substrate processing

> Lathes

> Electrical discharge machines

> Drilling machines

> Planers

> Milling machines

> Horizontal boring machines

Micrometer Bundle

Laser Scan Micrometers

Exceptional repeatability, accuracy, resolution, and durability - the ideal non-contact measurement solution for a wide variety of applications, including those that are too small or delicate for conventional contact measurement.

Non- Contact Measurement

Our laser scan micrometer portfolio includes a rich assortment of models that measure a vast array of materials with ease. Our solutions are capable of measuring ultra-fine wires down to 5 microns in diameter, as well as, larger cylindrical objects up to 160mm in dual mode. Each model delivers high scanning rates and complete traceability, resulting in an exceptional level of accuracy and repeatability.